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Home»Uncategorized»AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new tech – Tom's Hardware

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AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new tech – Tom's Hardware

By amministratore@overclockcomputer.itNovember 27, 2024No Comments1 Min Read

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AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new tech Tom’s Hardware
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AMD granted a glass substrate patent to revolutionize chip packaging — Intel, Samsung, and others racing to deploy the new tech – Tom's Hardware

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