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Home»Uncategorized»TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks – Tom's Hardware

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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks – Tom's Hardware

By amministratore@overclockcomputer.itNovember 29, 2024No Comments1 Min Read

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TSMC ‘Super Carrier’ CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks Tom’s Hardware
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TSMC 'Super Carrier' CoWoS interposer gets bigger, enabling massive AI chips to reach 9-reticle sizes with 12 HBM4 stacks – Tom's Hardware

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